Test Structures for the Wafer Mapping and Correlation of the Properties of Electroplated Ferromagnetic Alloy Films

Evgeny Sirotkin, Stewart Smith, Ross Walker, Jonathan Terry, Anthony Walton

Research output: Contribution to journalArticlepeer-review

Abstract

This paper presents a method of electrically determining the permeability of
patterned, electroplated ferromagnetic alloys and brings together the
simultaneous wafer mapping of relative permeability, electrical resistivity and
mechanical strain of these electrodeposited films, as well as the layer
thickness and alloy composition. The wafer mapping of all these properties is
implemented using a set of simple, automated electrical and optical techniques
that facilitate the quantification of the spatial correlation between different
parameters. This enables the uniformity of conductive ferromagnetic films to be
analysed and supports the optimization of the physical properties of these
materials as well as the processes used to deposit them.
Original languageEnglish
Pages (from-to)201-208
JournalIEEE Transactions on Semiconductor Manufacturing
DOIs
Publication statusPublished - 21 Jun 2016

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