This paper reports on the use of microelectronic test structures to characterize a novel fabrication technique for thin-film electronic circuit boards. In this technology circuit tracks are formed on paper-like substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. Sheet resistance and linewidth are electrically evaluated and these compared with optical and surface profiling measurements.
|Number of pages||6|
|Publication status||Published - 1 Jan 1998|
|Event||Proceedings of the 1998 IEEE International Conference on Microelectronic Test Structures - Kanazawa, Jpn|
Duration: 23 Mar 1998 → 26 Mar 1998
|Conference||Proceedings of the 1998 IEEE International Conference on Microelectronic Test Structures|
|Period||23/03/98 → 26/03/98|