The use of test structures to perform chip level characterisation studies of Ni and NiFe electrochemical deposition

Jeremy Murray*, Richard Perry, Jonathan G. Terry, Stewart Smith, Andrew Mount, Anthony J. Walton

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

This paper describes the first use of test structures designed to characterise the fundamental properties of nickel and nickel-iron alloy films deposited using electroplating. The structures are used to perform a chip-level investigation into the effects of electrolyte bath composition on the characteristics of deposited films. The advantage of this methodology is that each electrolyte change does not require the replacement of the large volume bath necessary for wafer level investigations, thereby making the characterisation and optimisation of electroplating baths far less time consuming, and considerably more cost effective.
Original languageEnglish
Pages (from-to)243-253
Number of pages11
JournalIEEE Transactions on Semiconductor Manufacturing
Volume30
Issue number3
Early online date12 Jul 2017
DOIs
Publication statusE-pub ahead of print - 12 Jul 2017

Keywords

  • Electrodeposition
  • MEMS
  • nickel
  • NiFe
  • Permalloy
  • optimisation
  • stress
  • strain
  • test structures
  • COBALT-NICKEL-IRON
  • BORIC-ACID
  • THIN-FILMS
  • INTERNAL-STRESS
  • SULFAMATE BATH
  • ELECTRODEPOSITION
  • ALLOYS
  • STRAIN
  • FABRICATION

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