Thermal design considerations for Greek cross test structures

S  Enderling; M H  Dicks; S  Smith; Tom Stevenson; A J  Walton

Thermal design considerations for Greek cross test structures

S Enderling, M H Dicks, S Smith, Tom Stevenson, A J Walton

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper analyses the temperature rises associated with the currents forced during the measurement of Greek cross test structures. Simulations were performed using Finite Element (FE) analysis software which indicated that the temperature can be dramatically reduced by decreasing the arm length and increasing the pad size of the Greek cross. Using these design rules it was practically confirmed that higher currents could be forced through Greek crosses without significant joule heating. As a result the voltage sensed when the Greek cross is measured is increased making the resolution of the voltmeter a less important issue.

Original language	English
Title of host publication	ICMTS 2003: PROCEEDINGS OF THE 2003 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES
Place of Publication	NEW YORK
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	813
Number of pages	6
ISBN (Print)	0-7803-7653-6
Publication status	Published - 2003
Event	16th International Conference on Microelectronic Test Structures - MONTEREY Duration: 17 Mar 2003 → 20 Mar 2003

Conference

Conference	16th International Conference on Microelectronic Test Structures
City	MONTEREY
Period	17/03/03 → 20/03/03

Cite this

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title = "Thermal design considerations for Greek cross test structures",

abstract = "This paper analyses the temperature rises associated with the currents forced during the measurement of Greek cross test structures. Simulations were performed using Finite Element (FE) analysis software which indicated that the temperature can be dramatically reduced by decreasing the arm length and increasing the pad size of the Greek cross. Using these design rules it was practically confirmed that higher currents could be forced through Greek crosses without significant joule heating. As a result the voltage sensed when the Greek cross is measured is increased making the resolution of the voltmeter a less important issue.",

author = "S Enderling and Dicks, {M H} and S Smith and Tom Stevenson and Walton, {A J}",

year = "2003",

language = "English",

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booktitle = "ICMTS 2003: PROCEEDINGS OF THE 2003 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

note = "16th International Conference on Microelectronic Test Structures ; Conference date: 17-03-2003 Through 20-03-2003",

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Enderling, S, Dicks, MH, Smith, S, Stevenson, T & Walton, AJ 2003, Thermal design considerations for Greek cross test structures. in ICMTS 2003: PROCEEDINGS OF THE 2003 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES. Institute of Electrical and Electronics Engineers (IEEE), NEW YORK, pp. 813, 16th International Conference on Microelectronic Test Structures, MONTEREY, 17/03/03.

Thermal design considerations for Greek cross test structures. / Enderling, S ; Dicks, M H ; Smith, S ; Stevenson, Tom; Walton, A J .

ICMTS 2003: PROCEEDINGS OF THE 2003 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES. NEW YORK : Institute of Electrical and Electronics Engineers (IEEE), 2003. p. 813.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Thermal design considerations for Greek cross test structures

AU - Enderling, S

AU - Dicks, M H

AU - Smith, S

AU - Stevenson, Tom

AU - Walton, A J

PY - 2003

Y1 - 2003

N2 - This paper analyses the temperature rises associated with the currents forced during the measurement of Greek cross test structures. Simulations were performed using Finite Element (FE) analysis software which indicated that the temperature can be dramatically reduced by decreasing the arm length and increasing the pad size of the Greek cross. Using these design rules it was practically confirmed that higher currents could be forced through Greek crosses without significant joule heating. As a result the voltage sensed when the Greek cross is measured is increased making the resolution of the voltmeter a less important issue.

AB - This paper analyses the temperature rises associated with the currents forced during the measurement of Greek cross test structures. Simulations were performed using Finite Element (FE) analysis software which indicated that the temperature can be dramatically reduced by decreasing the arm length and increasing the pad size of the Greek cross. Using these design rules it was practically confirmed that higher currents could be forced through Greek crosses without significant joule heating. As a result the voltage sensed when the Greek cross is measured is increased making the resolution of the voltmeter a less important issue.

M3 - Conference contribution

SN - 0-7803-7653-6

SP - 813

BT - ICMTS 2003: PROCEEDINGS OF THE 2003 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES

PB - Institute of Electrical and Electronics Engineers (IEEE)

CY - NEW YORK

T2 - 16th International Conference on Microelectronic Test Structures

Y2 - 17 March 2003 through 20 March 2003

ER -