Thermal design considerations for Greek cross test structures

S Enderling, M H Dicks, S Smith, Tom Stevenson, A J Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper analyses the temperature rises associated with the currents forced during the measurement of Greek cross test structures. Simulations were performed using Finite Element (FE) analysis software which indicated that the temperature can be dramatically reduced by decreasing the arm length and increasing the pad size of the Greek cross. Using these design rules it was practically confirmed that higher currents could be forced through Greek crosses without significant joule heating. As a result the voltage sensed when the Greek cross is measured is increased making the resolution of the voltmeter a less important issue.

Original languageEnglish
Title of host publicationICMTS 2003: PROCEEDINGS OF THE 2003 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES
Place of PublicationNEW YORK
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages813
Number of pages6
ISBN (Print)0-7803-7653-6
Publication statusPublished - 2003
Event16th International Conference on Microelectronic Test Structures - MONTEREY
Duration: 17 Mar 200320 Mar 2003

Conference

Conference16th International Conference on Microelectronic Test Structures
CityMONTEREY
Period17/03/0320/03/03

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