Thermal fatigue life prediction for a middle gull-wing joint using finite element analysis

M. M. Keegan*, Conchur O Bradaigh, D. Kearney, P. F. Monaghan

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Surface Mount Technology (SMT) is the process where Surface Mount Components (SMCs) are placed and soldered onto Printed Circuit Boards (PCBs). Reliability of the solder joint is a critical issue in SMT as the solder joint forms both the mechanical and electrical connection to the PCB. Thermal fatigue of the solder joint is caused by the combination of thermal cycling and the difference in Coefficient of Thermal Expansion (CTE) between the component and the PCB. The prime cause of solder joint failure is slow thermal fatigue failure [1,2]. Finite element analysis is widely used in the analysis of solder joints [3-6]. A nonlinear thermo-mechanical 2-D finite element model of a middle gull-wing joint is developed and used to determine the creep strains due to one thermal cycle. The thermal fatigue life is calculated using a Coffin-Manson expression which calculates the number of cycles for a 50% reduction in pull-strength (N50) from the average solder joint creep strain per cycle along the fracture surface.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, EEP
PublisherPubl by ASME
Pages499-507
Number of pages9
Volume4-1
Publication statusPublished - 1993
EventProceedings of the 1993 ASME International Electronics Packaging Conference - Binghamton, NY, USA, United Kingdom
Duration: 29 Sep 19932 Oct 1993

Conference

ConferenceProceedings of the 1993 ASME International Electronics Packaging Conference
Country/TerritoryUnited Kingdom
CityBinghamton, NY, USA
Period29/09/932/10/93

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