TY - JOUR
T1 - Validated physical models and parameters of bulk 3C-SiC aiming for credible technology computer aided design (TCAD) simulation
AU - Arvanitopoulos, A.
AU - Lophitis, N.
AU - Gyftakis, K. N.
AU - Perkins, S.
AU - Antoniou, M.
PY - 2017/9/19
Y1 - 2017/9/19
N2 - The cubic form of SiC (β- or 3C-) compared to the hexagonal α-SiC polytypes, primarily 4H- and 6H-SiC, has lower growth cost and can be grown heteroepitaxially in large area silicon (Si) wafers which makes it of special interest. This in conjunction with the recently reported growth of improved quality 3C-SiC, make the development of devices an imminent objective. However, the readiness of models that accurately predict the material characteristics, properties and performance is an imperative requirement for attaining the design and optimization of functional devices. The purpose of this study is to provide and validate a comprehensive set of models alongside with their parameters for bulk 3C-SiC. The validation process revealed that the proposed models are in a very good agreement to experimental data and confidence ranges were identified. This is the first piece of work achieving that for 3C-SiC. Considerably, it constitutes the necessary step for finite element method simulations and technology computer aided design.
AB - The cubic form of SiC (β- or 3C-) compared to the hexagonal α-SiC polytypes, primarily 4H- and 6H-SiC, has lower growth cost and can be grown heteroepitaxially in large area silicon (Si) wafers which makes it of special interest. This in conjunction with the recently reported growth of improved quality 3C-SiC, make the development of devices an imminent objective. However, the readiness of models that accurately predict the material characteristics, properties and performance is an imperative requirement for attaining the design and optimization of functional devices. The purpose of this study is to provide and validate a comprehensive set of models alongside with their parameters for bulk 3C-SiC. The validation process revealed that the proposed models are in a very good agreement to experimental data and confidence ranges were identified. This is the first piece of work achieving that for 3C-SiC. Considerably, it constitutes the necessary step for finite element method simulations and technology computer aided design.
KW - silicon carbide
KW - technology computer aided design (TCAD)
KW - wide bandgap
UR - http://www.scopus.com/inward/record.url?scp=85030087852&partnerID=8YFLogxK
UR - https://www.repository.cam.ac.uk/handle/1810/275512?show=full
U2 - 10.1088/1361-6641/aa856b
DO - 10.1088/1361-6641/aa856b
M3 - Article
AN - SCOPUS:85030087852
SN - 0268-1242
VL - 32
JO - Semiconductor science and technology
JF - Semiconductor science and technology
IS - 10
M1 - 104009
ER -