Edinburgh Research Explorer

A novel 3D-printing repair of surface cracks for improving the mechanical strength

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Standard

A novel 3D-printing repair of surface cracks for improving the mechanical strength. / Zhang, Yuanfei; Fan, Shaowei ; Li, Zhibin; Liu, Hong.

2017 IEEE/SICE International Symposium on System Integration (SII). Taipei, Taiwan : Institute of Electrical and Electronics Engineers (IEEE), 2018. p. 170-175.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Harvard

Zhang, Y, Fan, S, Li, Z & Liu, H 2018, A novel 3D-printing repair of surface cracks for improving the mechanical strength. in 2017 IEEE/SICE International Symposium on System Integration (SII). Institute of Electrical and Electronics Engineers (IEEE), Taipei, Taiwan, pp. 170-175, 2017 IEEE/SICE International Symposium on System Integration, Taipei, Taiwan, Province of China, 11/12/17. https://doi.org/10.1109/SII.2017.8279207

APA

Zhang, Y., Fan, S., Li, Z., & Liu, H. (2018). A novel 3D-printing repair of surface cracks for improving the mechanical strength. In 2017 IEEE/SICE International Symposium on System Integration (SII) (pp. 170-175). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/SII.2017.8279207

Vancouver

Zhang Y, Fan S, Li Z, Liu H. A novel 3D-printing repair of surface cracks for improving the mechanical strength. In 2017 IEEE/SICE International Symposium on System Integration (SII). Taipei, Taiwan: Institute of Electrical and Electronics Engineers (IEEE). 2018. p. 170-175 https://doi.org/10.1109/SII.2017.8279207

Author

Zhang, Yuanfei ; Fan, Shaowei ; Li, Zhibin ; Liu, Hong. / A novel 3D-printing repair of surface cracks for improving the mechanical strength. 2017 IEEE/SICE International Symposium on System Integration (SII). Taipei, Taiwan : Institute of Electrical and Electronics Engineers (IEEE), 2018. pp. 170-175