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Comparison of Conventional and Maskless Lithographic Techniques for More than Moore Post-processing of Foundry CMOS Chips

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Original languageEnglish
Pages (from-to)1245-1252
Number of pages8
JournalJournal of Microelectromechanical Systems
Issue number5
Early online date21 Aug 2020
Publication statusPublished - 21 Aug 2020


This paper details and compares the technology options for post–processing foundry produced CMOS at chip-scale to enable More than Moore functionality. In many cases there are attractions in using chip-based processing through the Multi-Project Wafer route that is frequently employed in research, early-stage development and low-volume production. This paper identifies that spray-based photoresist deposition combined with optical maskless lithography demonstrates sufficient performance combined with low cost and operational convenience to offer an attractive alternative to conventional optical lithography, where spin-coated photoresist is exposed through a patterned photomask.

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