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Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive

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http://apl.aip.org/resource/1/applab/v91/i9/p093123_s1
Original languageEnglish
Article number093123
Pages (from-to)-
Number of pages3
JournalApplied Physics Letters
Volume91
Issue number9
DOIs
Publication statusPublished - 27 Aug 2007

Abstract

This letter demonstrates the transfer and formation of aligned carbon nanotube (CNT) arrays at low temperature by imprinted conductive adhesive. A thermoplastic isotropic conductive adhesive is patterned by an imprint and heat transfer process. The CNTs grown by thermal chemical vapor deposition are then transferred to another substrate by the conductive adhesive, forming predefined patterns. The current-voltage response of the transferred CNT bundles verifies that good electrical connection has been established. This process can enable the integration of CNTs into various temperature-sensitive processeses and materials.

    Research areas

  • CONTACT TRANSFER

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